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Precision micro‑hole component for optical modules, MEMS devices, fiber coupling bases and hermetic opto‑packaging

Name: Precision micro‑hole component for **optical modules, MEMS devices, fiber coupling bases and hermetic opto‑packaging**
Brand: WEL Techno Co., LTD.
SKU: None
Price: 0.10 USD
Availability: InStock

Product Details

Place of Origin: China

Brand Name: WEL

Certification: ISO9001

Model Number: None

Payment & Shipping Terms

Minimum Order Quantity: 100

Price: USD

Packaging Details: Industrial Packaging

Delivery Time: 8WEEKS

Payment Terms: T/T

Supply Ability: 100000

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Product Details

Product Description

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                                                precision micro-hole component for optical modules, MEMS devices CNC machining parts, fiber coupling bases with warranty
                              

Precision micro‑hole component for **optical modules, MEMS devices, fiber coupling bases and hermetic opto‑packaging**

1.Application

Precision micro‑hole component for optical modules, MEMS devices, fiber coupling bases and hermetic opto‑packaging. 0.3 mm fine aperture for fiber positioning, optical path transmission and venting. Ensure optical alignment and hermetic sealing, widely used in data‑center optical transceivers.

2.Material & Performance

Kovar alloy (Fe‑Ni‑Co). Thermal expansion matches glass & ceramic for reliable glass‑to‑metal hermetic sealing. Good weldability and thermal dimensional stability. Aperture dimension stable under temperature cycling. RoHS compliant.

3.Processing

Precision CNC machining + laser micro‑drilling. Machine profile & mounting holes; laser drill Φ0.3 mm fine hole. Full deburring, no burr or chipping on hole inner wall. Control thin‑part distortion.

4.Accuracy & Requirement

Tolerance ±0.01 mm; micro‑hole Φ0.3±0.005 mm; hole position tolerance ≤0.01 mm; Ra≤0.8 μm. Operating temp‑40℃~+125℃. Protect micro‑hole against impact and blockage; assemble without squeezing; keep dust‑free environment.

5.Heat Treatment

Stress‑relief annealing, release machining stress, stabilize micro‑hole dimension, prevent aperture shift under thermal cycling.

6.Post‑treatment

Degreasing & ultra‑sonic cleaning; gold / nickel plating optional for solderability & anti‑corrosion.

7.Quality Control

ISO9001 system. Spectroscopic material verification; microscope inspection for micro‑hole quality; CMM full dimension test; particle‑controlled cleaning.Industrial Packaging: Individual clean vacuum PE bag, anti‑static box. Moisture‑proof vacuum tray packing for bulk orders, prevent micro‑hole clogging.

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Precision micro‑hole component for **optical modules, MEMS devices, fiber coupling bases and hermetic opto‑packaging**